CDU 2.X

High-Flow Liquid Cooling. Built for What Comes Next.

The high-flow CDU with the hydraulic headroom to support today’s AI racks and the platforms that follow.

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More Than Megawatts. More Hydraulic Headroom.

AI rack densities increase, flow-per-kW and rack pressure drop requirements are rising. Headline megawatt capacity alone does not show whether a CDU can deliver the required flow at usable pressure.

With up to 2.5 MW of cooling at 4°C ATD, CDU 2.X occupies the capacity sweet spot between conventional rack-scale CDUs and centralized liquid cooling platforms.

One CDU Architecture. Multiple Generations of AI.

AI compute platforms continue to evolve, bringing higher flow-per-kW and rack differential-pressure requirements.

CDU 2.X is designed around these changing requirements rather than one silicon specification.

Its common architecture supports today’s demanding AI deployments while providing a path for the successive platforms that follow.

Configured for Your Infrastructure.

Your facility shouldn’t have to adapt to the CDU. CDU 2.X can be configured around your facility, operating model, and performance requirements.

Site-Specific Configuration Options

  • CCV or PICV facility control valve• Standard or ultra-low-harmonic VFDs
  • Dual A/B power feeds or dual feed with ATS
  • Top or bottom piping connections
  • Modbus RTU, RESTful API with Redfish, BACnet or SNMP
  • Rope leak detection, flow metering and fluid-quality monitoring

Flexible and Resilient Deployment

CDU 2.X supports end-of-row and rack-adjacent layouts, with configurable redundancy to suit different operating strategies.

  • Single-pump mode supports internal N+1 pump redundancy
  • Dual-pump mode supports CDU-to-CDU redundancy
  • Concurrently maintainable pumps and 25-micron secondary strainers
  • Fast-acting control valves and integrated leak detection

Efficient Integration with Your Facility.

CDU 2.X is designed to integrate efficiently with the facility cooling and electrical infrastructure.

1

Low-Approach Thermal Performance

Supports cooling at low approach temperatures, improving heat-transfer performance and providing greater flexibility when integrating the technology-cooling and facility-water loops.

2

Warm-Water Operation

Supports facility water inlet temperatures of up to 45°C, providing flexibility for warm-water cooling architectures.

3

Specifiable Power Quality

<br>Optional ultra-low-harmonic VFDs meet IEEE 519 requirements at less than 5% THDi, helping<br>operators address harmonic performance at the CDU.

Built for High-Density AI Deployments

CDU 2.X provides a flexible liquid-cooling platform for:

High-density AI training and inference infrastructure

New data center deployments and capacity expansions

End-of-row and rack-adjacent cooling architectures

Facilities requiring configurable power, controls and redundancy

Deployments designed to accommodate successive compute platforms

Ready to configure your cooling architecture?

Work with LiquidStack to configure CDU 2.X around your rack requirements, facility infrastructure, redundancy strategy, and operating model.

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Featured Resources

Frequently Asked Questions

  • Why Direct-to-Chip Cooling for AI

    Direct-to-chip liquid cooling delivers coolant directly to CPUs and GPUs via cold plates, removing heat at the source without submerging hardware. It maintains standard server form factors, supports retrofit and hybrid environments, and offers the most practical path to high-density liquid cooling for most AI deployments. Some residual airflow is still required for non-chip components, making hybrid architectures common in practice.

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  • Air vs Liquid Cooling for AI Infrastructure

    Air cooling is practical for low-density environments but struggles beyond approximately 30–50 kW per rack, making it unsuitable for modern AI workloads. Liquid cooling delivers significantly higher heat transfer efficiency, supports rack densities of 100 kW and above, and reduces energy consumption at scale. This article compares both approaches across density, efficiency, and deployment readiness to help you determine when the switch to liquid cooling is justified.

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  • CDUs vs Rear Door Heat Exchangers

    CDUs and rear door heat exchangers (RDHx) both address the limits of conventional air cooling, but serve different roles. RDHx units extend existing air-cooled infrastructure with minimal server changes, making them a viable transitional solution at moderate densities. CDUs enable true direct-to-chip liquid cooling, supporting rack densities above 100 kW and providing a scalable path from rack-level to hyperscale deployments.

    Learn More