Cooling Capacity

A cooling capacity of up to 110kW, supports chip Thermal Design Power (TDP) up to 1,000W. With up to 2.8kW per unit, it caters to high-performance cooling needs.


Advanced Flow Technology

“Direct injection” and “infinity pool” fluid distribution enhance heat transfer efficiency. This innovative approach ensures optimal cooling by maximizing contact with heat-generating components.


Optimized Dimensions

Tailored for data center retrofits and modular containers by matching the width of four standard IT racks (4 x 600mm rack spaces), the unit can also be positioned sideways in a standard ISO container. Moreover, its front-service access eliminates the need for side or rear maintenance space.


Flexible Connection Points

Accommodates top or bottom piping and electrical connections to offer installation flexibility, particularly beneficial for retrofitting. This adaptability allows for seamless integration into various site configurations.


Qualified Fluids

The system supports a range of tested and qualified fluids from various suppliers, enabling users to select the fluid that best meets their material compatibility, performance, and safety requirements. This ensures that users can tailor the cooling solution to their needs.

single phase

Immediate ROI

LiquidStack single phase immersion solutions reduce energy use on day one.

Space Savings

Our single phase immersion solutions provide more than 55% white space savings over air-cooled systems.

Energy Savings

Our single phase immersion solutions are more energy-efficient compared to traditional air cooling methods, delivering 80% energy savings (PUE)


Up to


Cooling capacity

Up to


Designed for chip with high TDPs

The highest cooling capacity solutions on the market


Thermal design power (TDP)

Supports chips rated up to 1,000W and minimizes power consumption.

Advanced flow technology

Advanced flow technology

Optimizes heat transfer and rejection, as low as 1.03 pPUE, by leveraging warmer water temperatures.

Optimized system dimensions

Optimized system dimensions

Ensures data center retrofit and modular containers that fit between 4 x 600mm rack spaces and sideways in a standard ISO container.

Maximum cooling flow and
heat transfer

Maximum cooling flow and
heat transfer

Directs fluid into server chassis to cool servers equipped with the latest high TDP chips.

Enhanced cooling effectiveness

Enhanced cooling effectiveness

Delivers improved energy efficiency and additional fluid distribution throughout the unit.

Typical applications and use cases include

Regional edge, retrofitting existing data center infrastructure, artificial intelligence (AI), OTT, advanced cloud services, video and graphics rendering, high performance computing (HPC), and other low latency, high processing applications in the following sectors:

  • Colocation
  • Telecommunication
  • Enterprise (industrial, oil and gas)
  • High Performance Compute (HPC)
  • Cryptomining
  • Government and military

Trusted by the Biggest Names in Data Center Technology

LiquidStack provides next-generation cooling solutions to many of the world’s largest cloud services, semiconductor, manufacturing and IT hardware providers, and has won numerous awards for data center innovation and sustainability.

Connect with our team to explore the optimal liquid cooling options for your organization

From maximum power density performance to meeting new environmental and regulatory standards, LiquidStack can help you adopt the technology or technologies that make most sense for you.

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